LIU Xuejian, ZHANG J unji, SUN Xingwei, PU Xipeng, HUANG Liping

( Shanghai Institute of Ceramics, Chinese Academy of Science)

Abstract: Surface passivation is one of the essential processing for high -perfomance integrated circuits .The characteristics of existed surface passivated films for integrated circuits, such as silica, alumina, and silicon nitride films, have been reviewed and discussed in detail.Silicon nitride film has promising application for surface passivation in the large scale integrated circuits ( LSI) .It is an inevitable trent for LSI that chemical vapor deposition of silicon nitride film at low temperature .One of an efficient way is to develop new organic precursors as nitrogen and/or silicon sources that can deposit silicon nitride film at relative low temperature .The essential principle of the organic precursors is still expatiated on .

Keywords: integrated circuits, surface passivation, film, silicon nitride, CVD, organic precursor