JIANG Fangle , SHI Weihua , SHENG Caoqun , ZHU Qingxia , SHI Qun

(School of Materials Science and Engineering, Jingdezhen Ceramic Institute, Jingdezhen Jiangxi 333403, China)

Abstract: Building ceramic bodies with different moisture elimination rates were tested with a thermal conductivity meter to determinate their thermal capability. Thermally conductive adhesive was applied between the copper flat and the ceramicbody to reduce the impact of contact thermal resistance, and the experimental error was analyzed. The experimental result

indicates that, with the increase of moisture elimination rate, the thermal conductivity increases, and it increases linearly as temperature increases.

Key words: building ceramic; moisture elimination rate; thermal conductivity; experiment; error analysis