FAN Binbin 1, ZHAO Lin 1, XIE Zhipeng 1,2
(1. School of Material Science and Engineering, Jingdezhen Ceramic Institute, Jingdezhen 333403, Jiangxi, China; 2. State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China)
Abstract: Joining of ceramic and metal parts is widely used in new energy vehicles, electronic power devices, semiconductor packaging and IGBT modules. Therefore, it is crucial to realize ceramic-metal sealing processes with high strength and high air tightness. Currently, there have been in-depth studies and significant progress has been achieved in this area. Various methods, such as metal powder sintering (ceramic metallization), active metal brazing and copper-coated ceramic substrate, have been reported in open literature. This paper is aimed to review the technologies for industrialization of this field and the applications widely for the joining of ceramics and metals in the last 20 years, while the future development of the related technologies will be discussed.
Key words: joining of ceramics and metals; sealing process; ceramic metallization; copper-coated ceramic substrate