LÜ Shuaishuai 1, ZHOU Yuxiang 1, NI Wei 1, MA Libin 2, HE Jingyu 2, NI Hongjun 1
(1. School of Mechanical Engineering, Nantong University, Nantong 226019, Jiangsu, China; 2. Laiding Electronic Materials
Technology Co., Ltd., Nantong 226019, Jiangsu, China)
Abstract: Aluminum nitride ceramics has the advantage of high thermal conductivity, high temperature insulation, excellent dielectric properties, good corrosion resistance and matching expansion properties with semiconductor Si, which is an ideal material for electronic packaging. The key technologies of aluminum nitride ceramic powder preparation, molding process and sintering are summarized. This paper focuses on the status of the technological development in the sintering of aluminum nitride ceramics. The key technologies of high thermal conductivity aluminum nitride ceramics are forecasted at the end.
Key words: high thermal conductivity; aluminum nitride; powder preparation; molding; sintering