All Issue
Research Progress in Shaping Technology of AlN Ceramics with High Thermal Conductivity

SHENG Pengfei 1, NIE Guanglin 1, LI Yehua 1, LIN Lifu 1, WU Haolin 1, BAO Yiwang 2, WU Shanghua

(1. School of Mechatronic Engineering, Guangdong University of Technology, Guangzhou 510006, Guangdong, China;  2. State Key Laboratory of Green Building Materials, China Building Materials Academy, Beijing 100024, China)

Abstract: AlN ceramics have high thermal conductivity, close thermal expansion coefficient to that of Si and excellent chemical inertness, thus having broad applications in the fields of electronic information, energy and chemical industry, transportation and so on. As a result, they have attracted great attentions of both the domestic and overseas researchers. The shaping of AlN ceramics with high thermal conductivity is crucial for their practical engineering applications. In this paper, the research progress in the forming and preparation of AlN ceramics was overviewed. The advantages and disadvantages of molding pressing, tape casting, injection molding, gel casting and 3D printing technology for the preparation of AlN ceramic parts were systematically compared. In addition, the superiority of 3D printing technology for the molding and preparation of complex-shaped AlN ceramic parts was elaborated. The development trend and prospect of the shaping technology of AlN ceramic parts were discussed.

Key words: AlN ceramics; shaping processing; thermal conductivity; 3D printing

  • View full text】Downloadedtimes

Print    Favorites      export BibTex      export EndNote      export XML