LAN Jian 1, MA Siqi 2, LI Yike 3, YIN Lisong 1
(1. School of Intelligent Manufacturing, Wuyi University, Jiangmen 529020, Guangdong, China; 2. School of Applied Physics and Materials, Wuyi University, Jiangmen 529020, Guangdong, China; 3. Jiangmen Keheng Industrial Co., Ltd., Jiangmen 529040, Guangdong, China)
Abstract: Aluminum nitride ceramics can be used as package heat dissipation substrate and electronic component, due to their high thermal conductivity, promising electrical properties, high mechanical strength and high chemical stability. The performance of aluminum nitride ceramics is strongly dependent on the quality of the powders. To obtain aluminum nitride ceramics with excellent properties, it is necessary to prepare high-quality aluminum nitride powders. With the advent of the 5G era, aluminum nitride is the most ideal material as substrates, thus attracting intensive attentions. By focusing on structure and performance, this article was aimed to systematically discuss the processing and research status of aluminum nitride powders. The factors influencing the properties of aluminum nitride powders were explained, while the effects of catalysts were compared and discussed. Then, the thermal application of aluminum nitride in 5G copper-clad laminates was experimentally explored and the development prospects of aluminum nitride in the future were ellaborated.
Key words: sluminum nitride powder; materials processing; inorganic filler; thermal conductivity