ZHONG Ming ¹, ZHAN Yuangen ², SUN Jian ¹, LI Jie ¹
(1. School of Materials Science and Engineering, Jingdezhen Ceramic University, Jingdezhen 333403, Jiangxi, China; 2. School of Information and Engineering, Jingdezhen Ceramic University, Jingdezhen 333403, Jiangxi, China)

Abstract: In order to solve the problem of ceramic packaging chip failure caused by too high temperature, based on a multiple hole micro jet heat sink structure, several geometric physical models and heat transfer and flow mathematical models of heat sinks with different structures were constructed, while their heat transfer and flow characteristics were numerically simulated. In order to improve the temperature uniformity of the cooled surface and improve the heat transfer and cooling effect of the heat sink, the inlet and outlet structures of the heat sink were optimized, while the heat transfer effects were compared and analyzed when the cylindrical and prismatic fins were installed. The heat dissipation capacity of the side inlet structure is ncreased by 2.7%, as compared with that of the circular return structure. The two-layer intake structure increased by 5.4%, but the two-layer intake structure led to a sharp increase in pressure loss. The annular reflux structure is increased by 8.6%. Heat transfer efficiency of the heat sink can be greatly improved by including fin structure. The prismatic fin structure exhibited an increase of 15.3%, which is obviously higher than that (12.2%) of cylindrical fin structure. It is therefore concluded that heat transfer capacity of heat sink can be enhanced by increasing the fin height properly.
Key words: porous micro fluidic; structure optimization; strengthening heat transfer; the numerical simulation