ZHANG Xinyi, HUO Jinghao, ZHOU Bo, YUAN Xiaoyan, LIU Yi, GUO Shouwu
(Shaanxi University of Science and Technology, Xi'an 710021, Shaanxi, China)
Abstract: Reduced graphene oxide (rGO)/polymer composites are often used as thermal interface materials for electronic components because of their high flexibility and high thermal conductivity, but the reduced graphene oxide sheets are easy to agglutinate and the thermal conductivity is anisotropic, and the thermal conductivity can be improved by adding thermal conductive filler to build a thermal conductivity path. The reduced graphene oxide/silicon carbide/carbon composites were prepared by electrospinning and high-temperature calcination with LED lamp as the research object. rGO/SiC/C/EP composite films were prepared by blending with epoxy resin. The effects of different amounts of rGO on thermal conductivity of the composite films were studied. The results show that the composite has a three-dimensional network structure, and the rGO layer is inserted between the SiC/C nanofibers, which effectively prevents the stacking problem of rGO, and the SiC/C nanofibers form an effective thermal conduction path between the rGO laminates, thereby improving the thermal conductivity of the material. The thermal conductivity of rGO/SiC/C/EP-2 composite film reaches 2.097 W·m−1·K−1, indicating that the composite of SiC and rGO can effectively improve the thermal conductivity. This research provides a new thermal conductivity material for electronic devices and other applications requiring thermal management.
Key words: thermal interface material; reduced graphene oxide; SiC nanofibers; epoxy resin; thermal conductivity