HAN Wen 1, YANG Zhenheng 1, SUI Xudong 2, XU Lei 1, ZENG Shijin 2, YU Shengrui 1, XU Han 1
(1. Jingdezhen Ceramic University, Jingdezhen 333403, Jiangxi, China; 2. Keda Industrial Group Co., Ltd., Foshan 528313, Guangdong, China)
Abstract: This paper was aimed to address the serious issues of over-polishing and under-polishing in the production of ceramic tiles, which significantly affect product quality. Mathematical models were established to correlate polishing process parameters and motion parameters with variables related to over-polishing and under-polishing, based on the Preston equation and the grinding head outer profile trajectory equation. According to the simulation analysis results, it is revealed that over-polishing primarily occurs in the overlapping regions of the polishing trajectory, with a smaller proportion distributed in the upper and lower arc regions of the trajectory. As the polishing process parameters are modified, an increase in the width of the leak-free polishing zone corresponds to an enlargement of the overlapping area. It is possible to reduce the width of the leak-free polishing zone by 17.91%, simultaneously resulting in a 53.06% reduction in the overlapping area, by adjusting the polishing process parameters. This significant improvement effectively enhances the over-polishing situation, markedly promoting grinding uniformity. These findings offer a theoretical foundation for optimizing polishing trajectories in practical production of ceramic tiles.
Key words: uniformity; polishing process parameters; grinding; Preston equation; simulation analysis